Copper
The PELCO® FIB lift-out TEM Grids have been designed for in-situ lift to attach the TEM lamellae milled out by SEM/FIB or FIB systems. The design has been optimised for access and flexibility. The nominal diameter of the sturdy PELCO® FIB lift-out grids is 3mm. These grids fit all standard TEM holders and provide a full view of the thin section attached to the posts.
SEM images of narrow and wide posts showing set-back and shape
The typical thickness of the copper lift-out grids is 35µm /-5µm. The Cu FIB lift-out grids also have a thinner ridge on the inside, where the lamella can be attached and are protected when stored. Available with either one or two wider v-shaped posts or four narrow flat posts. An identification number is etched into the grid. Use single or dual wide posts for attaching a single lamella or the four posts for attaching a larger number of lamellae. Size of wide post is 250 x 35 x 190µm (W x D x H), size of narrow post is 80 x 35 x 190µm (W x D x H).
Molybdenum
Silicon
The thickness of the silicon lift-out grids is 100µm which makes them compatible with all standard TEM holders. Perfect half circular shape which fits nicely in the TEM grid holder. Debris-free, metal-free lift-out grids which readily bond with Pt to attach the lamellae. Straight edges, similar to the Cu and Mo grids; easy to handle. B-doped, conductive silicon minimises charging during sample preparation and TEM imaging. Available with four narrow posts, which can be shaped if needed. Post size is 80 x 100 x 190µm (W x D x H).
Copper/beryllium
The PELCO® FIB lift-out half grid is made of stiff copper beryllium with a thickness of 100µm. Has two dots on one side for easy identification. Diameter 3mm with a height of 1.5mm. Slot is 2mm wide x 0.5mm deep. This robust half grid offers easy handling and good protection for the TEM lamellae.
The Omniprobe® lift-out grids are specifically designed to accept the TEM lamellae milled out by FIB or SEM/FIB systems. Typical thickness of the grids is 25-30µm with a diameter of 3mm. The posts are designed for optimum access and provide a secure area for attaching (welding) the lamella(e). The Omniprobe® grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts. Available in standard Cu with 3, 4 and 5 posts and in Mo with 3 and 4 posts. All lift-out grids have multiple indexed mounting positions for easy identification and positioning in the TEM.
Copper and molybdenum, 3 posts
Because there is a sharp edge rather than a rounded corner, it makes it very easy to see exactly where to place the lamella when mounting to the side of a post.
Copper, 3 posts, side access
Copper, 4 posts
Copper, 5 posts
Beryllium, half grids
For 100 grids
Overall size is 55 x 51 x 10.7mm.
For 100 grids
Overall size is 55 x 51 x 10.7mm.
For 4 grids
Without support film
The PELCO® silicon aperture frames are 3mm disc type frames with a thickness of 200µm and square or rectangular apertures. They are made with the same clean, state-of-the-art manufacturing techniques as the PELCO® silicon nitride support films. The silicon nitride has been removed, leaving a silicon frame. They are perfectly round, 3mm frames, featuring the Easygrip™ edge for easy handling. No broken edges and free of debris often associated with other manufacturing processes. Offered with three sizes of openings: 0.5 x 0.5, 1.0 x 1.0 and 1.5 x 0.5mm. Fully compatible will standard 3mm TEM holders.
- Support frame to attach TEM lamellae made with FIB, DualBeam® or CrossBeam® instruments for subsequent TEM imaging
- Easy access due to wide angle opening
- Protects TEM lamella during transport
Window angle toward the back is 35.26 degrees, which results in aperture dimensions:
| Cat. No. | Aperture size | Area | Reverse side opening |
|---|---|---|---|
| GF316-05 | 0.5 x 0.5mm | 0.25mm² | 0.78 x 0.78mm |
| GF316-10 | 1.0 x 1.0mm | 1.00mm² | 1.28 x 1.28mm |
| GF316-15 | 1.5 x 0.5mm | 0.75mm² | 1.78 x 1.78mm |
Aluminium, diameter 12.7mm
These special low profile pin mounts are available flat, as a 90° mount, and with specific angles ideally suited to accommodate specimens with small working distances in FIB, DualBeam and CrossBeam systems. Made of aluminium. Fully compatible with standard pin stub mounts (pin 3.2mm diameter) for sample storage and transport. These mounts can be used directly in FEI and TESCAN systems with the standard pin length, ZEISS/LEO systems with the short 6mm pin, and with pin adapters in Hitachi and JEOL systems.
Seven types are available:
- Universal flat pin mount with either standard or short pin
- Universal 90 degree pin mount with either standard or short pin
- 38° complimentary angle pin mount for FEI Quanta and Helios Dualbeams
- 36° complimentary angle pin mount for ZEISS/LEO CrossBeam, NVISON, and AURIGA systems
- 35° complimentary angle pin mount for TESCAN LYRA and VELA FIBxSEM systems
Flat, regular pin
Flat, short pin
90°, regular pin
90°, short pin
38°, regular pin
36°, short pin
35°, short pin
The low profile double TEM grid holder holds two lift-out grids and has a spring-loaded jaw for easy unloading. This holder has a short standard pin-style post base: ø3.2 x 4mm length, to accommodate thinner-type stage plates used in full wafer systems. Made of aluminium and all non-magnetic materials.
On 102mm silicon wafers
Silicon wafers with thin films of silicon dioxide are available in thicknesses of 23, 50, 97 and 102.9nm. The oxide films are grown with a wet oxygen process, which ensures a higher degree of uniformity than other processes. The wafers are 102mm in diameter.
On 37 x 37mm Ta foil
Films of tantalum pentoxide (100nm) are anodically grown on 0.5mm thick tantalum foil. The standards measure 37 x 37mm. The thickness accuracy is ~5%.
On a 10 x 30mm section of a polished silicon wafer
Consisting of 12 alternating layers: 6 layers of Cr (~53nm) and 6 layers of Ni (~64nm) for a total thickness of ~700nm with a maximum variation across the 75mm production wafer of ±2%. Standard is on a 10 x 30mm section of a polished silicon wafer. The mass density of Cr and Ni was measured using electron beam excitation and measuring characteristic X-ray intensities.